한국전기화학회

Vol.5, No.3, August 2002

Fabrication of Porous Reticular Metal by Electrodeposition of Fe/Ni Alloy for Heat Dissipation MaterialsFe/Ni 합금전착에 의한 다공성 그물군조 방열재료의 제조 연구: JKES Vol.5, No.3, pp.125~130, August 2002; DOI : 10.5229/JKES.2002.5.3.125

Hwa-Young Lee, Kwan-Hyi Lee and Won-Young Jeung

Metals Processing Research Center, Korea Institute of Science & Technology, P. O. Box 131, Cheongryang, Seoul 130-650, Korea

An attempt was made for the application of porous reticular metal to a heat dissipation material in semiconductor process. For this aim, the electrodeposition of Fe/Ni alloy on the porous reticular Cu has been performed to minimize the thermal expansion m

Keyword : heat dissipation, porous reticular metal, electrodeposition, Fe/Ni layer

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JKES

Vol.5, No.3, August 2002